High performance – Very soft
Based on silicone and a special filler material. TP-2 offers excellent thermal conductivity despite its extremely low hardness.
Bridging the gaps
TP-2 is softer than conventional pads and therefore particularly suitable for different chip heights. Thanks to their good compressibility properties, thermal pads act as the perfect gap filler and bridge uneven surface and air gaps without stressing sensitive and protruding components.
They are available in different thicknesses and sizes
Thermal pads are available in 0.5mm, 1.0mm and 1.5mm options. The 0.5 mm variant is ideal as an alternative to thermally conductive aluminum foil. The pads are available in different dimensions, depending on their thickness. If required, the pads can also be cut independently to any size.
